Addressing the persistent thermal and electrical limitations in advanced packaging, nanoSkunkWorkX has secured $220K in Seed funding. The startup specializes in process-level interface devices, with its initial commercial offering, nSD-I, designed to enhance copper routing for AI applications without disrupting existing manufacturing flows or requiring new capital equipment.
nSD-I, a nanostructured Scalable Device - Interconnect, targets critical areas such as RDL, interposer, and high-current copper structures. The company, which builds its solutions on the SUSANNE electrochemical interface-engineering platform, is currently focused on converting its measured copper enhancements into qualification-grade evidence for package integration.
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